PCB Capability
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| SIZE | COPPER PLATING WEIGHT | |||||||
| Maximum active Panel size | 24 ” * 30 ” | MAX. COPPER WEIGHT | 5oz (7mil, 175um) | |||||
| (609mm*762mm) | MIN. COPPER WEIGHT | Half oz (0.7mil, 17um) | ||||||
| THICKNESS | HOLE SIZE TOLERANCE | |||||||
| Maximum processed/finished thickness | 0.260” (6.6 mm ) | PTH Hole size standard tolerance | +/-0.003'' (0.075mm) | |||||
| Minimum processed/finished thickness | 0.008” ( 0.2 mm ) | NPTH Hole size standard tolerance | +/-0.002'' (0.05mm) | |||||
| Board thickness tolerance | +/- 10% | True position tolerance | +/-0.002 '' (0.05mm) | |||||
| Warpage /bow and twist inch per inch | 0.75 % | Minimum CONDUCTOR WIDTH | ||||||
| LAYER CONSTRUCTION | Minimum trace width inner layer | 0.003'' (0.075mm) | ||||||
| Maximum processed layer count | 26L | Minimum trace width outer layer | 0.003'' (0.075mm) | |||||
| HDI processed layer count | Anylayer | Minimum CONDUCTOR SPACE | ||||||
| Minimum core thickness | 0.002” ( 0.05mm ) | Minimum space copper to copper inner layer | 0.002'' (0.05mm) | |||||
| Minimum Prepreg thickness | 0.002”( 0.05mm ) | Minimum space copper to Copper outer layer | 0.002'' (0.05mm) | |||||
| ASPECT RATIO | Minimum space drill to copper | 0.006'' (0.15mm) | ||||||
| Maximum aspect ratio- plated through holes for Rigid PCB | 20:1 | Minimum annular ring inner layer | 0.003'' (0.075mm) | |||||
| Maximum aspect ratio – Laser blind via holes for HDI | 0.8:1 | Minimum annular ring outer layer | 0.003'' (0.075mm) | |||||
| MECHANICALLY DRILLED HOLE SIZES | Minimum plane clearance inner layer | 0.008'' (0.2mm) | ||||||
| Minimum mechanically drilled through holes size | 0.008” (0.2mm) | Minimum plane clearance outer layer | 0.006'' (0.15mm) | |||||
| Smallest finished PTH | 0.006” (0.15mm) | CONTROLLED IMPEDANCE | ||||||
| Laser DRILLED HOLE SIZES | Impedance typical – value ohms | 50 ohm,90 ohm,100ohm | ||||||
| Minimum laser drilled blind holes size | 0.004” (0.1mm) | Impedance typical – tolerance | +/- 10% | |||||
| Smallest finished PTH | 0.003” (0.075mm) | SOLDER MASK AND LEGEND | ||||||
| TECHNOLOGY | Nominal solder mask thickness | 0.4 mil (0.01mm) | ||||||
| Buried vias - mechanically | Yes | Solder mask type | Liquid | |||||
| Conductive via fill | Yes | Minimum solder mask clearance to pad | 0.002'' (0.05mm) | |||||